Parameters |
Factory Lead Time |
6 Weeks |
Lifecycle Status |
ACTIVE (Last Updated: 5 days ago) |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
256-BGA |
Number of Pins |
256 |
Operating Temperature |
0°C~90°C TJ |
Packaging |
Tray |
Series |
OMAP-L1x |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory |
Other Microprocessor ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.2V |
Frequency |
375MHz |
Base Part Number |
OMAPL137 |
Operating Supply Voltage |
1.2V |
Interface |
SPI, USB |
Max Supply Voltage |
1.32V |
Min Supply Voltage |
1.14V |
Memory Size |
32kB |
RAM Size |
128kB |
Memory Type |
Cache |
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER |
Core Processor |
ARM926EJ-S |
Data Bus Width |
16b |
Core Architecture |
ARM |
Boundary Scan |
YES |
Low Power Mode |
YES |
Format |
FLOATING POINT |
Integrated Cache |
YES |
Voltage - I/O |
1.8V 3.3V |
Number of UART Channels |
3 |
Ethernet |
10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
USB |
USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
Additional Interfaces |
HPI, I2C, McASP, MMC/SD, SPI, UART |
Number of Timers |
3 |
Co-Processors/DSP |
Signal Processing; C674x, System Control; CP15 |
Number of Cores |
1 |
Barrel Shifter |
NO |
Internal Bus Architecture |
SINGLE |
Display & Interface Controllers |
LCD |
Height |
2.05mm |
Length |
17mm |
Width |
17mm |
Thickness |
1.36mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
OMAPL137DZKB3 Overview
The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. There are 1 Core 32-Bit cores per bus width on the CPU. Identify the operating temperature around 0°C~90°C TJ. It comes from the OMAP-L1x series. The CPU is cored by a processor with a number of 0 cores. There are SDRAM RAM controllers used by this CPU. A HPI, I2C, McASP, MMC/SD, SPI, UART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 1.8V 3.3V. There is DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER in the uPs, uCs, or peripheral ICs categories. To find variants of the microprocessor, try searching with OMAPL137. Overall, there are 256 terminations. Using a 1.2V voltage supply, you should be able to operate the cpu microprocessor. 375MHz Hz is the frequency at which the CPU operates. Please refer to the datasheets for 256 pins functions. This microprocessor is a typical Other Microprocessor ICs. Generally, data transfer takes place at a rate of 16b bandwidth. A CPU with 1 cores. Surface Mount mounted, this CPU is widely used in many applications. In this case, 1.2V is the starting point. Random-Access Memory (RAM) is designed with an amount of 128kB KB. It is generally recommended that users do not supply their embedded microprocessors with voltages higher than 1.32V. A voltage of 1.14V is recommended for feeding the embedded microprocessor. Its memory size is 32kB. A total of 3 UART (Universal Asynchro3us Receiver/Transmitter) channels are available on this embedded microprocessor
OMAPL137DZKB3 Features
ARM926EJ-S Core
16b-Bit Data Bus Width
1-Core CPU
128kB RAM
OMAPL137DZKB3 Applications
There are a lot of Texas Instruments OMAPL137DZKB3 Microprocessor applications.
- Magnetic resonance imaging (MRI)
- Toasters
- Refrigerators
- Computers and laptops-video calling, email, blogging
- Fire alarms
- Security systems
- Virtual reality VR robots
- Heart rate monitors
- Binding machines
- Television