NL17SZ07EDFT2G
| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 5-TSSOP, SC-70-5, SOT-353 |
| Surface Mount | YES |
| Operating Temperature | -55°C~125°C TA |
| Packaging | Tape & Reel (TR) |
| Series | 17SZ |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 |
| Number of Terminations | 5 |
| Terminal Finish | Tin (Sn) |
| Technology | CMOS |
| Voltage - Supply | 1.65V~5.5V |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.65mm |
| Reach Compliance Code | compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | 17SZ07 |
| JESD-30 Code | R-PDSO-G5 |
| Output Type | Open Drain |
| Number of Elements | 1 |
| Supply Voltage-Max (Vsup) | 5.5V |
| Family | LVC/LCX/Z |
| Number of Inputs | 1 |
| Current - Output High, Low | - 24mA |
| Logic Type | Buffer, Non-Inverting |
| Length | 2mm |
| RoHS Status | RoHS Compliant |
NL17SZ07EDFT2G Overview
Logical driver uses a neat 5-TSSOP, SC-70-5, SOT-353 package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 1.65V~5.5V. Qualified to operate within -55°C~125°C TA. The high and low logic state output current of logical driver is - 24mA. Logical driver can deal with Open Drain output (s). All of the 1 elements are put into use. Digital buffer is one of the 17SZ series devices. 5 terminations with different functions. Buffer IC reuqires a supply voltage of 1.8V. Electronic parts from the LVC/LCX/Z family are used in this part. You can search "17SZ07" for other related electrical components. Digital buffer is characterized to have 1 inputs.
NL17SZ07EDFT2G Features
NL17SZ07EDFT2G Applications
There are a lot of ON Semiconductor NL17SZ07EDFT2G Buffers & Transceivers applications.
- Wireless access points
- Laser diode bonding
- Ethernet circuitry
- Fiber-to-the-desktop
- TV signal transmission
- Interconnection between switches and computers
- Satellite radio receiver
- Satellite communications networks
- Indoor ad hoc meeting
- Precision engineering measurement