MT90870AG2
| Parameters | |
|---|---|
| Factory Lead Time | 26 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 272-BGA |
| Supplier Device Package | 272-PBGA (27x27) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Published | 2010 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3V~3.6V |
| Function | Switch |
| Number of Circuits | 1 |
| Current - Supply | 160mA |
| RoHS Status | ROHS3 Compliant |
MT90870AG2 Overview
In order to save space on the board, 272-BGA packages are used.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.Telecommunications equipment consists of 1 circuits.3V~3.6V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.The supply current is 160mA.
MT90870AG2 Features
Available in the 272-BGA package
MT90870AG2 Applications
There are a lot of Microchip Technology MT90870AG2 Telecom applications.
- T1/E1/J1 LAN/WAN Routers
- ISDN NT1/TA
- Digital Modems
- Interfaces to SONET STS-1 Networks
- DECT (Digital European Cordless Telephone) Base Stations
- Fiber to the Home (FTTH)
- T1/E1/J1 Multiplexer and Channel Banks
- PBX interfaces
- CSU/DSU E1/T1/J1 Interface
- Integrated Multi-Service Access Platforms (IMAPs)