MS05

MS05

CONN IC DIP SOCKET 12POS GOLD


  • Manufacturer: Apex Microtechnology
  • Origchip NO: 94-MS05
  • Package: -
  • Datasheet: PDF
  • Stock: 973
  • Description: CONN IC DIP SOCKET 12POS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Through Hole
Mounting Type Through Hole
Number of Pins 12
Housing Material Polyester, Glass Filled
Number of Positions or Pins (Grid) 12 (2 x 6)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Packaging Bulk
Series Apex Precision Power®
Feature Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 1.2 (30.48mm) Row Spacing
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Tin
Termination Post Length 0.270 6.86mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
See Relate Datesheet

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