MPC852TZT66A
| Parameters | |
|---|---|
| Package / Case | 256-BBGA |
| Supplier Device Package | 256-PBGA (23x23) |
| Operating Temperature | 0°C~95°C TA |
| Packaging | Tray |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 66MHz |
| Core Processor | MPC8xx |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Additional Interfaces | HDLC/SDLC, PCMCIA, SPI, UART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | Non-RoHS Compliant |
MPC852TZT66A Overview
The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. In order to provide high reliability, advanced packaging method Tray is used. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Recognize operating temperatures around 0°C~95°C TA. In the series MPC8xx, it is found. A MPC8xx processor powers this CPU. A CPU with this architecture uses DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, PCMCIA, SPI, UART. At 3.3V, the CPU runs its I/O. Suppliers offer 256-PBGA (23x23) packages.
MPC852TZT66A Features
MPC8xx Core
MPC852TZT66A Applications
There are a lot of Rochester Electronics, LLC MPC852TZT66A Microprocessor applications.
- Blenders
- Fabric
- Radio
- Fax machines
- Virtual reality VR robots
- Guidance-GPS
- Missile control
- Ipod
- Security systems
- Laminators