| Parameters |
| Factory Lead Time |
10 Weeks |
| Package / Case |
473-LFBGA |
| Operating Temperature |
-40°C~105°C TA |
| Packaging |
Tray |
| Published |
2002 |
| Series |
MPC83xx |
| JESD-609 Code |
e0 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| ECCN Code |
3A991.A.2 |
| Terminal Finish |
Tin/Lead (Sn/Pb) |
| HTS Code |
8542.31.00.01 |
| Technology |
CMOS |
| Peak Reflow Temperature (Cel) |
260 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Base Part Number |
MPC8308 |
| Speed |
266MHz |
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC |
| Core Processor |
PowerPC e300c3 |
| Voltage - I/O |
1.8V 2.5V 3.3V |
| Ethernet |
10/100/1000Mbps (3) |
| Number of Cores/Bus Width |
1 Core 32-Bit |
| Graphics Acceleration |
No |
| RAM Controllers |
DDR2 |
| USB |
USB 2.0 (1) |
| Additional Interfaces |
DUART, HSSI, I2C, MMC/SD/SDIO, SPI |
| RoHS Status |
Non-RoHS Compliant |
MPC8308CZQADDA Overview
The embedded microprocessor has been packed in 473-LFBGA for convenient overseas shipping. In order to provide high reliability, advanced packaging method Tray is used. There are 1 Core 32-Bit cores/bus width on the CPU. The operating temperature around -40°C~105°C TA should be understood. In the series MPC83xx, it is found. The CPU is cored by a processor with a number of 0 cores. A CPU with this architecture uses DDR2 RAM controllers. The microprocessor features interfaces DUART, HSSI, I2C, MMC/SD/SDIO, SPI for better service. At 1.8V 2.5V 3.3V, the CPU runs its I/O. A MICROPROCESSOR, RISC represents the uPs/uCs/Peripheral ICs type. Search MPC8308 for variants of the embedded microprocessor.
MPC8308CZQADDA Features
PowerPC e300c3 Core
MPC8308CZQADDA Applications
There are a lot of NXP USA Inc. MPC8308CZQADDA Microprocessor applications.
- Computed Tomography (CT scan)
- Gas monitoring systems
- Industrial control field
- Auto-breaking system
- Removable disks
- Projector
- Hand-held metering systems
- Medical instruments
- Dryers
- Washing machine