| Parameters |
| Factory Lead Time |
12 Weeks |
| Package / Case |
529-LFBGA |
| Operating Temperature |
-40°C~125°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2017 |
| Series |
i.MX6SX |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Speed |
200MHz, 800MHz |
| Core Processor |
ARM® Cortex®-A9, ARM® Cortex®-M4 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.15V |
| Ethernet |
10/100/1000Mbps (2) |
| Number of Cores/Bus Width |
2 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
| USB |
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
| Additional Interfaces |
AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
| Co-Processors/DSP |
Multimedia; NEON™ MPE |
| Security Features |
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
| Display & Interface Controllers |
Keypad, LCD, LVDS |
| RoHS Status |
ROHS3 Compliant |
MCIMX6X4AVM08ACR Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 529-LFBGA. Advanced packaging method Tape & Reel (TR) is used to provide high reliability. Cores/Bus width of the CPU is 2 Core 32-Bit . The operating temperature around -40°C~125°C TJ should be understood. From the i.MX6SX series. The CPU is powered by a ARM? Cortex?-A9, ARM? Cortex?-M4 core. There are LPDDR2, LVDDR3, DDR3 RAM controllers on this CPU. This microprocessor features AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC interfaces to better serve its users. There is 1.8V 2.5V 2.8V 3.15V I/O running on this CPU.
MCIMX6X4AVM08ACR Features
ARM? Cortex?-A9, ARM? Cortex?-M4 Core
MCIMX6X4AVM08ACR Applications
There are a lot of NXP USA Inc. MCIMX6X4AVM08ACR Microprocessor applications.
- Measurement and control field
- Smartphone
- Metering & measurement field
- Ipad
- Answering machines
- Electronic jamming systems
- 3D printers
- Projectors
- Radio
- Consumer electronics products