| Parameters |
| Factory Lead Time |
15 Weeks |
| Package / Case |
400-LFBGA |
| Operating Temperature |
-20°C~105°C TJ |
| Packaging |
Tray |
| Series |
i.MX6SX |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| HTS Code |
8542.39.00.01 |
| Peak Reflow Temperature (Cel) |
260 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Speed |
227MHz, 1GHz |
| Core Processor |
ARM® Cortex®-A9, ARM® Cortex®-M4 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.15V |
| Ethernet |
10/100/1000Mbps (2) |
| Number of Cores/Bus Width |
2 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
| USB |
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
| Additional Interfaces |
AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
| Co-Processors/DSP |
Multimedia; NEON™ MPE |
| Security Features |
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
| Display & Interface Controllers |
Keypad, LCD, LVDS |
| RoHS Status |
ROHS3 Compliant |
MCIMX6X3EVK10AC Overview
Since the microprocessor is packed in 400-LFBGA, shipping overseas is convenient. High reliability can be achieved by using the advanced packaging method Tray. CPUs have 2 Core 32-Bit cores/bus width. The operating temperature around -20°C~105°C TJ should be understood. In the series i.MX6SX, it is found. With a core count of ARM? Cortex?-A9, ARM? Cortex?-M4, this CPU is multicore. There are LPDDR2, LVDDR3, DDR3 RAM controllers used by this CPU. This microprocessor features AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART interfaces to better serve its users. 1.8V 2.5V 2.8V 3.15V is the CPU's I/O address.
MCIMX6X3EVK10AC Features
ARM? Cortex?-A9, ARM? Cortex?-M4 Core
MCIMX6X3EVK10AC Applications
There are a lot of NXP USA Inc. MCIMX6X3EVK10AC Microprocessor applications.
- Process control devices
- Calculators
- Switches
- Telephone sets
- Tape drives
- Food and beverage
- Digital TVs
- Consumer electronics products
- Microwave ovens
- Refrigerators