MCIMX6U5DVM10AD
| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-LFBGA |
| Operating Temperature | 0°C~95°C TJ |
| Packaging | Tray |
| Series | i.MX6DL |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| HTS Code | 8542.39.00.01 |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
MCIMX6U5DVM10AD Overview
The embedded microprocessor has been packed in 624-LFBGA for convenient overseas shipping. The packaging method Tray provides high reliability. The CPU has 2 Core 32-Bit cores/Bus width. The operating temperature around 0°C~95°C TJ should be understood. A i.MX6DL series item. Core-wise, this CPU has a ARM? Cortex?-A9 processor. Memory controllers for this CPU are LPDDR2, LVDDR3, DDR3. This microprocessor has CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to serve you better. I/O is run at 1.8V 2.5V 2.8V 3.3V on this CPU.
MCIMX6U5DVM10AD Features
ARM? Cortex?-A9 Core
MCIMX6U5DVM10AD Applications
There are a lot of NXP USA Inc. MCIMX6U5DVM10AD Microprocessor applications.
- Heater/Fan
- Christmas lights
- Switches
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- 3D printers
- Consumer electronics products
- Process control devices
- Measurement and control field
- Robots
- Multi-meter