MCIMX6S6AVM08ADR
| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Package / Case | 624-LFBGA |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tape & Reel (TR) |
| Series | i.MX6S |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 800MHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
MCIMX6S6AVM08ADR Overview
The microprocessor is convenient for international shipping since it is packaged in 624-LFBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Understand the operating temperature around -40°C~125°C TJ. This is part of the i.MX6S series. Core-wise, this CPU has a ARM? Cortex?-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. The microprocessor features interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART for better service. I/O is run at 1.8V 2.5V 2.8V 3.3V on this CPU.
MCIMX6S6AVM08ADR Features
ARM? Cortex?-A9 Core
MCIMX6S6AVM08ADR Applications
There are a lot of NXP USA Inc. MCIMX6S6AVM08ADR Microprocessor applications.
- Smartphone
- Set-top boxes
- Washing machine
- Hand-held metering systems
- Speed meter
- Industrial robot
- Medical instruments
- Sonography (Ultrasound imaging)
- Robots
- Instrumentation and process control field