| Parameters |
| Factory Lead Time |
15 Weeks |
| Package / Case |
624-LFBGA |
| Operating Temperature |
-20°C~105°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2002 |
| Series |
i.MX6S |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Speed |
1.0GHz |
| Core Processor |
ARM® Cortex®-A9 |
| Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
| Ethernet |
10/100/1000Mbps (1) |
| Number of Cores/Bus Width |
1 Core 32-Bit |
| Graphics Acceleration |
Yes |
| RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
| USB |
USB 2.0 + PHY (4) |
| Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP |
Multimedia; NEON™ SIMD |
| Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers |
Keypad, LCD |
| RoHS Status |
ROHS3 Compliant |
MCIMX6S5EVM10ACR Overview
Due to its 624-LFBGA packaging, it is convenient to ship overseas. Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around -20°C~105°C TJ. It comes from the i.MX6S series. The CPU is cored with a ARM? Cortex?-A9 processor. There are LPDDR2, LVDDR3, DDR3 RAM controllers used by this CPU. To serve better this microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces. 1.8V 2.5V 2.8V 3.3V is the I/O speed of this CPU.
MCIMX6S5EVM10ACR Features
ARM? Cortex?-A9 Core
MCIMX6S5EVM10ACR Applications
There are a lot of NXP USA Inc. MCIMX6S5EVM10ACR Microprocessor applications.
- Printers
- Computers and laptops-video calling, email, blogging
- Oil and gas
- Calculators
- Day to day life field
- Temperature sensing and controlling devices
- Scanners
- Auto-breaking system
- Home appliances
- Fabric