MCIMX6S5DVM10ADR
| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-LFBGA |
| Operating Temperature | 0°C~95°C TJ |
| Packaging | Tape & Reel (TR) |
| Series | i.MX6S |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
MCIMX6S5DVM10ADR Overview
The microprocessor is conveniently packaged in 624-LFBGA, making it easy to ship internationally. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. K0°C~95°C TJw what the operating temperature is around 0°C~95°C TJ. In the i.MX6S series, it is found. The CPU is cored by a processor with a number of 0 cores. LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. Featuring CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces, this microprocessor can better serve you. 1.8V 2.5V 2.8V 3.3V is the CPU's I/O address.
MCIMX6S5DVM10ADR Features
ARM? Cortex?-A9 Core
MCIMX6S5DVM10ADR Applications
There are a lot of NXP USA Inc. MCIMX6S5DVM10ADR Microprocessor applications.
- Microwave ovens
- Smartphone
- Heater/Fan
- Industrial instrumentation devices
- Fax machines
- Switches
- 8. Navigation control field
- Equipment control
- Petrochemical
- Network communication, mobile communication field