Parameters | |
---|---|
Factory Lead Time | 10 Weeks |
Package / Case | 289-LFBGA |
Surface Mount | YES |
Operating Temperature | -40°C~125°C TJ |
Packaging | Tray |
Published | 2013 |
Series | i.MX6UL |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 289 |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Terminal Pitch | 0.8mm |
JESD-30 Code | S-PBGA-B289 |
Supply Voltage-Max (Vsup) | 1.3V |
Supply Voltage-Min (Vsup) | 1.15V |
Number of I/O | 131 |
Speed | 528MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Core Processor | ARM® Cortex®-A7 |
Clock Frequency | 528MHz |
Supply Current-Max | 500mA |
Address Bus Width | 16 |
Boundary Scan | YES |
External Data Bus Width | 16 |
RAM (words) | 32000 |
Voltage - I/O | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100Mbps (2) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | LPDDR2, DDR3, DDR3L |
USB | USB 2.0 + PHY (2) |
Additional Interfaces | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Number of Serial I/Os | 9 |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Bus Compatibility | CAN, ETHERNET, I2C, I2S, SPI, UART, USB |
Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers | LCD, LVDS |
Height Seated (Max) | 1.32mm |
Length | 14mm |
RoHS Status | ROHS3 Compliant |
The i.MX 6UltraLite is a high-performance, ultra-efficient processor family featuring NXP’s advanced implementation of the single ARM Cortex?-A7 core, which operates at speeds up to 696 MHz. The i.MX 6UltraLite includes an integrated power management module that reduces the complexity of the external power supply and simplifies the power sequencing. Each processor in this family provides various memory interfaces, including LPDDR2, DDR3, DDR3L, Raw and Managed NAND flash, NOR flash, eMMC, Quad SPI, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth?, GPS, displays, and camera sensors.
Single-core Arm Cortex-A7—The single-core A7 provides a cost-effective and power-efficient
solution.
Multilevel memory system—The multilevel memory system of the processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processor supports
many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR
Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including
eMMC up to rev 4.4/4.41/4.5.
Smart speed technology—Power management implemented throughout the IC that enables
multimedia features and peripherals to consume minimum power in both active and various low
power modes.
Dynamic voltage and frequency scaling—The power efficiency of devices by scaling the voltage
and frequency to optimize performance.
Multimedia powerhouse—The multimedia performance of the processor is enhanced by a multilevel
cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart
DMA (SDMA) controller, an asynchronous audio sample rate converter, an Electrophoretic
Display (EPD) controller, and a Pixel processing pipeline (PXP) to support 2D image processing,
including color-space conversion, scaling, alpha-blending, and rotation.
2x Ethernet interfaces—2x 10/100 Mbps Ethernet controllers.
Telematics
Human Machine Interfaces (HMI)