MC35FS6512CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6512CAER2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.At System Basis Chip and other applications, this power management is targeted.It is recommended that the operating temperature of the power management ic be set to -40°C~150°C TA to prevent malfunctions.The power management works at 1V~5V voltage.There are a manage ics from Automotive, AEC-Q100 .
MC35FS6512CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6512CAER2 Applications
There are a lot of NXP USA Inc. MC35FS6512CAER2Power Management applications.
- Camera Power Applications
- Automotive cluster
- Industrial Equipment
- System Thermal for PCs
- Power Factor Correction
- Automotive Digital Cluster
- SSTL-2 WHITE SPACE
- Tablets
- Radar system ECU
- Office Electronics