MC33PF8200DHESR2
| Parameters | |
|---|---|
| Factory Lead Time | 2 Weeks |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200DHESR2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .For easy adaptation, Surface Mount, Wettable Flank is a universal mounting method.It targets applications such as High Performance i.MX 8, S32x Processor Based and others.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.The power management runs on 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8200DHESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200DHESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200DHESR2Power Management applications.
- Applications Processors
- SmartPhones
- WOA
- Automotive Infotainment
- Automotive camera module
- Office Electronics
- Laser TV
- Computing
- Projection Mapping
- Automotive Infotainment