MC33FS6522NAE
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6522NAE Overview
Ready for shipping the power management in Tray package.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.Surface Mount is a universal mounting method for easy adaptation.The power management is targeted at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.This power management uses 1V~5V voltage for work.
MC33FS6522NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6522NAE Applications
There are a lot of NXP USA Inc. MC33FS6522NAEPower Management applications.
- Data Storage
- Automotive Advanced Driver Assistance System (ADAS)
- System Thermal for PCs
- LP2996A: DDR3
- Field Service
- Supplement In-Circuit Tester (ICT) Access
- Optical imaging payload
- Portable Media Players
- Port/cable dongles
- Industrial PC