MC33FS6504LAER2
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6504LAER2 Overview
Using Tape & Reel (TR) as a shipping the power management path is acceptable.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method for easy adaptation.Applications targeting this power management include System Basis Chip and others.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.The power management runs on 1V~5V voltage.
MC33FS6504LAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6504LAER2 Applications
There are a lot of NXP USA Inc. MC33FS6504LAER2Power Management applications.
- Memory Power
- LP2996A: DDR2
- Industrial Telemetry Applications
- Switches
- GPS
- Camera Power Applications
- Networking Equipment
- Space satellite point of load supply
- Chromebook
- Portable Navigation Devices