MC33FS6502NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6502NAER2 Overview
Ready for shipping the power management in Tape & Reel (TR) package.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is an universal mounting way for easy adapting.There are a number of applications targeted at System Basis Chip .Ensure that the operating temperature of the power management ic is set to -40°C~125°C in order to prevent malfunctions.It works with 1V~5V voltage.
MC33FS6502NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6502NAER2 Applications
There are a lot of NXP USA Inc. MC33FS6502NAER2Power Management applications.
- Medical
- FPGA, DSP Core Power
- Peripheral I/O Power
- Termination Voltage
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Motherboard
- Cluster
- Industrial Equipment
- Wireless routers
- Automotive display