MC33FS4502LAE
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4502LAE Overview
Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method for easy adaptation.The power management is designed for use with applications at System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management operates at 1V~5V volts.
MC33FS4502LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4502LAE Applications
There are a lot of NXP USA Inc. MC33FS4502LAEPower Management applications.
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Desktop PC
- SSTL-18 Termination
- Applications Processors
- Power Factor Correction
- LP2996-N: DDR1 Termination Voltage
- Power Supplies
- Automotive display
- DDR-II Termination Voltage
- Wireless routers