MAX2322EUP+

MAX2322EUP+

MAX2322EUP+ datasheet pdf and RF Misc ICs and Modules product details from Rochester Electronics, LLC stock available at Feilidi


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-MAX2322EUP+
  • Package: 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: 373
  • Description: MAX2322EUP+ datasheet pdf and RF Misc ICs and Modules product details from Rochester Electronics, LLC stock available at Feilidi (Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
Packaging Tube
JESD-609 Code e3
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN
Construction COMPONENT
Frequency 1.85GHz~1.91GHz
Function Dual Band LNA/Mixer
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
RF/Microwave Device Type DOWN CONVERTER
RF Type PCS
Characteristic Impedance 50Ohm
LO Tunable YES
Down Conversion Gain-Min 9.6 dB
Noise Figure-Max 13.5 dB
RoHS Status ROHS3 Compliant
See Relate Datesheet

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