M2S090TS-FCSG325
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.There is one thing to note about this SoC security: it combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.In total, this SoC part has 180 I/Os.A 1.2V power supply is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.At least 1.14V can be supplied as a power source.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.As a result, there are 325 terminations in total, which does really benefit system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 180 outputs, which is convenient.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 180.System on chips of logic are comprised of 86316 logic cells.The flash is set to 512KB.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090TS-FCSG325 System On Chip (SoC) applications.
- Functional safety for critical applications in the aerospace
- Networked sensors
- Published Paper
- Microprocessors
- Central inverter
- AC drive control module
- Robotics
- Video Imaging
- Industrial automation devices
- Transmitters