M2S090T-FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package.With 64KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 180 inputs and outputs.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.In the SoCs wireless, voltages above 1.26V are considered unsafe.At least 1.14V can be supplied as a power source.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.A system on a chip benefits from having 325 terminations.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 180 outputs.A power supply of 1.2V is required to run system on chip.The SoC chip is equipped with 180 inputs.A logic SoC has 86316 logic cells.There is a flash of 512KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090T-FCSG325I System On Chip (SoC) applications.
- Published Paper
- External USB hard disk/SSD
- Temperature
- Body control module
- Central inverter
- Microcontroller based SoC ( RISC-V, ARM)
- System-on-chip (SoC)
- Central alarm system
- POS Terminals
- USB hard disk enclosure