M2S090-FGG484
| Parameters | |
|---|---|
| Core Architecture | ARM |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.44mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 12 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 484-BGA |
| Surface Mount | YES |
| Number of Pins | 484 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S090 |
| Number of Outputs | 267 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Supply Voltage-Max (Vsup) | 1.26V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 267 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Its package is 484-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.A state-of-the-art Tray package houses this SoC system on a chip.267 I/Os in total are included in this SoC part.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.A SoC chip like this can have 267 outputs.A logic SoC has 86316 logic cells.This flash has a size of 512KB.M2S090 will give you system on chips with similar specifications and purposes.In this wireless SoC, the frequency is set to 166MHz.It uses ARM as its core architecture.The computer SoC is available in 484-pin form.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-FGG484 System On Chip (SoC) applications.
- Three phase UPS
- Networked Media Encode/Decode
- Level
- Healthcare
- Digital Media
- Microprocessors
- Mobile market
- Wireless networking
- Industrial automation devices
- Servo drive control module