M2S090-FCS325I
| Parameters | |
|---|---|
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 4 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.It is important to note that this SoC security combines FPGA - 90K Logic Modules.Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 180 inputs and outputs.It is advised to utilize a 1.2V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.system on a chip benefits from 325 terminations.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.Using this SoC chip, you have the option of having 180 outputs.As far as power supplies are concerned, system on chip requires 1.2V.The SoC chip is equipped with 180 inputs.The logic system on chips contain 86316 logic cells.The flash size of the SoC meaning is 512KB.Aside from that, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-FCS325I System On Chip (SoC) applications.
- Deep learning hardware
- Automotive
- Industrial automation devices
- Smart appliances
- Defense
- Robotics
- Central inverter
- Digital Media
- Personal Computers
- Video Imaging