M2S060TS-FGG484

M2S060TS-FGG484

484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060TS-FGG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 181
  • Description: 484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Package 484-BGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.The SmartFusion?2 series contains this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.267 I/Os are available in this SoC part.It is advised to utilize a 1.2V power supply.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.At least 1.14V can be supplied as a power source.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 484 terminations, so system on a chip is really aided by this.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.This SoC chip is capable of having 267 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.A SoC chip with 267 inputs is available.There are 56520 logic cells in the logic system on chips.This flash has a size of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-FGG484 System On Chip (SoC) applications.

  • Smartphones
  • AC-input BLDC motor drive
  • Communication network-on-Chip (cNoC)
  • ARM processors
  • Central alarm system
  • ARM
  • Medical Pressure
  • Three phase UPS
  • Microprocessors
  • Deep learning hardware

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