M2S060TS-1VFG400I

M2S060TS-1VFG400I

400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060TS-1VFG400I
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 272
  • Description: 400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 400-LFBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.207 I/Os in total are included in this SoC part.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.There is a possibility that it can be powered by a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.As a result, there are 400 terminations in total, which does really benefit system on a chip.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 207 outputs.There is 1.2V power supply requirement for this system on chip SoC.207 inputs are available on the SoC chip.The logic system on chips contain 56520 logic cells.This flash has a size of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-1VFG400I System On Chip (SoC) applications.

  • Efficient hardware for training of neural networks
  • Healthcare
  • Sports
  • CNC control
  • String inverter
  • Robotics
  • Industrial Pressure
  • Servo drive control module
  • Deep learning hardware
  • Measurement tools

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