M2S060T-FGG484I

M2S060T-FGG484I

484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 663
  • Description: 484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.267 I/Os are included in this SoC part.It is recommended to use a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supplies of at least 1.14V are required.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 484 terminations, so system on a chip is really aided by this.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.A SoC chip with 267 outputs is available.This system on chip SoC requires 1.2V power supply at all.This SoC chip is equipped with 267 inputs for the user to choose from.56520 logic cells are present in logic system on chips.As for its flash size, it is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060T-FGG484I System On Chip (SoC) applications.

  • Temperature Sensors
  • Industrial automation devices
  • Efficient hardware for training of neural networks
  • POS Terminals
  • Sports
  • Mouse
  • Keywords
  • PC peripherals
  • Apple smart watch
  • Industrial robot

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