Parameters |
Factory Lead Time |
10 Weeks |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
267 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
267 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
267 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 60K Logic Modules |
Number of Logic Cells |
56520 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Manufacturer assigns package 484-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.The SmartFusion?2 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 267 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.There is no safe voltage for the SoCs wireless above 1.26V.Power supplies of at least 1.14V are required.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 484 terminations, which makes system on a chip possible.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.The SoC chip that comes with this module can be configured to have 267 outputs.System on chip requires 1.2V power supplies.There are 267 inputs available on the SoC chip.The logic SoC features 56520 logic cells.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-1FG484I System On Chip (SoC) applications.
- Digital Signal Processing
- Wireless sensor networks
- AC drive control module
- Special Issue Editors
- Industrial
- Functional safety for critical applications in the industrial sectors
- Smart appliances
- Microcontroller based SoC ( RISC-V, ARM)
- External USB hard disk/SSD
- Efficient hardware for inference of neural networks