M2S060T-1FG484I

M2S060T-1FG484I

484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-1FG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 651
  • Description: 484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Manufacturer assigns package 484-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.The SmartFusion?2 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 267 I/Os.Ideally, a power supply with a voltage of 1.2V should be used.There is no safe voltage for the SoCs wireless above 1.26V.Power supplies of at least 1.14V are required.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 484 terminations, which makes system on a chip possible.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.The SoC chip that comes with this module can be configured to have 267 outputs.System on chip requires 1.2V power supplies.There are 267 inputs available on the SoC chip.The logic SoC features 56520 logic cells.The flash size of the SoC meaning is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060T-1FG484I System On Chip (SoC) applications.

  • Digital Signal Processing
  • Wireless sensor networks
  • AC drive control module
  • Special Issue Editors
  • Industrial
  • Functional safety for critical applications in the industrial sectors
  • Smart appliances
  • Microcontroller based SoC ( RISC-V, ARM)
  • External USB hard disk/SSD
  • Efficient hardware for inference of neural networks

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