M2S050TS-1VFG400
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 400-LFBGA |
| Supplier Device Package | 400-VFBGA (17x17) |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 207 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 50K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.The manufacturer assigns this system on a chip with a 400-LFBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part has a total of 207 I/Os.A flashing 256KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050TS-1VFG400 System On Chip (SoC) applications.
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