M2S050-FG896I
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 896-BGA |
| Supplier Device Package | 896-FBGA (31x31) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 377 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 50K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 896-BGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines FPGA - 50K Logic Modules and that is something to note.Housed in the state-of-art Tray package.377 I/Os are available in this SoC part.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050-FG896I System On Chip (SoC) applications.
- Microcontroller based SoC ( RISC-V, ARM)
- Functional safety for critical applications in the automotive
- sequence controllers
- Keyboard
- Networked Media Encode/Decode
- Robotics
- POS Terminals
- Medical
- Cyber security for critical applications in the aerospace
- External USB hard disk/SSD