M2S050-1FGG896

This SoC is built on ARM? Cortex?-M3 core processor(s).

This SoC is built on ARM? Cortex?-M3 core processor(s).There is a 896-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the SmartFusion?2 series of system on a chips.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 50K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 377.There is a flash of 256KB on it.Searching M2S050 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.In order for the SoC computing to start up, 0°C is sufficient.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S050-1FGG896 System On Chip (SoC) applications.

• Vending machines
• Industrial automation devices
• Mobile market
• Medical Pressure
• Defense
• Networked sensors
• Industrial Pressure
• Wireless networking
• Networked Media Encode/Decode
• Functional safety for critical applications in the automotive