Parameters |
Factory Lead Time |
10 Weeks |
Package / Case |
400-LFBGA |
Supplier Device Package |
400-VFBGA (17x17) |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
195 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 10K Logic Modules |
Flash Size |
256KB |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 400-LFBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion?2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines FPGA - 10K Logic Modules is important.Tray package houses this SoC system on a chip.This SoC part has a total of 195 I/Os.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-VF400I System On Chip (SoC) applications.
- Microcontroller
- Three phase UPS
- Digital Media
- Networked Media Encode/Decode
- Industrial automation devices
- Fitness
- Keywords
- Transmitters
- Cyber security for critical applications in the aerospace
- System-on-chip (SoC)