M2S010T-VF256I
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 138 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 138 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 138 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 10K Logic Modules |
| Number of Logic Cells | 12084 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.There is a 256-LFBGA package assigned to this system on a chip by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the SmartFusion?2 series of system on a chips.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.There is one thing to note about this SoC security: it combines FPGA - 10K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.138 I/Os are available in this SoC part.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 256 terminations, which makes system on a chip possible.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 138 outputs, which is convenient.This system on chip SoC requires 1.2V power supply at all.138 inputs are available on the SoC chip.The logic SoC features 12084 logic cells.This flash has a size of 256KB.This SoC processor also includes LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010T-VF256I System On Chip (SoC) applications.
- Digital Signal Processing
- Smartphone accessories
- Deep learning hardware
- Three phase UPS
- ARM processors
- Automotive gateway
- Functional safety for critical applications in the industrial sectors
- Central inverter
- Remote control
- Defense