M2S010-VF400I

M2S010-VF400I

400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 195 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010-VF400I
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 341
  • Description: 400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 195 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 195
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 195
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 195
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 400-LFBGA package.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion?2 series contains this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.It is important to note that this SoC security combines FPGA - 10K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 195 I/Os.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, voltages above 1.26V are considered unsafe.If it has at least a 1.14V volt power supply, it can work fine.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.system on a chip benefits from 400 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 195 outputs.In order to use system on chip, you will need a power supply of 1.2V.There are 195 inputs available on the SoC chip.In logic system on chips, there are 12084 logic cells.It has a 256KB flash.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S010-VF400I System On Chip (SoC) applications.

  • Microprocessors
  • Three phase UPS
  • Networked sensors
  • Smartphones
  • Smartphone accessories
  • Automotive gateway
  • Networked Media Encode/Decode
  • AC-input BLDC motor drive
  • Deep learning hardware
  • AC drive control module

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