Parameters |
Factory Lead Time |
12 Weeks |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
256-LBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
161 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
161 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
161 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 5K Logic Modules |
Number of Logic Cells |
6060 |
Flash Size |
128KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 5K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 161 inputs and outputs.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.There is a possibility that it can be powered by a power supply of at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.system on a chip benefits from 256 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 161 outputs.There is 1.2V power supply required for system on chip.This SoC chip is equipped with 161 inputs for the user to choose from.A logic SoC has 6060 logic cells.There is a flash of 128KB on it.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005S-VFG256 System On Chip (SoC) applications.
- Efficient hardware for training of neural networks
- Print Special Issue Flyer
- Industrial sectors
- Industrial transport
- Video Imaging
- Smart appliances
- Healthcare
- AC-input BLDC motor drive
- Transmitters
- Industrial