| Parameters |
| Factory Lead Time |
8 Weeks |
| Package / Case |
144-LQFP |
| Supplier Device Package |
144-TQFP (20x20) |
| Operating Temperature |
0°C~85°C TJ |
| Packaging |
Tray |
| Series |
SmartFusion®2 |
| Part Status |
Active |
| Number of I/O |
213 |
| Speed |
166MHz |
| RAM Size |
64KB |
| Core Processor |
ARM® Cortex®-M3 |
| Peripherals |
DDR |
| Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture |
MCU, FPGA |
| Primary Attributes |
FPGA - 5K Logic Modules |
| Flash Size |
128KB |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Assigned with the package 144-LQFP, this system on a chip comes from the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is a member of the SmartFusion?2 series.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines FPGA - 5K Logic Modules.It comes in a state-of-the-art Tray package.This SoC part contains a total of 213 I/Os in total.There is a flash of 128KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
There are a lot of Microsemi Corporation
M2S005S-1TQG144T2 System On Chip (SoC) applications.
- Apple smart watch
- RISC-V
- Industrial automation devices
- Wireless sensor networks
- Efficient hardware for inference of neural networks
- DC-input BLDC motor drive
- Three phase UPS
- Central inverter
- ARM support modules
- Test and Measurement