M2S005-1VFG256

M2S005-1VFG256

256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S005-1VFG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 926
  • Description: 256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 161
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 161
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 161
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 5K Logic Modules
Number of Logic Cells 6060
Flash Size 128KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 256-LBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.As one of the most important things to note is that this SoC security combines FPGA - 5K Logic Modules together.Housed in the state-of-art Tray package.As a whole, this SoC part is comprised of 161 inputs and outputs.It is recommended to use a 1.2V power supply.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.This SoC system on a chip can run on a power supply that is at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.There are 256 terminations in total and that really benefits system on a chip.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.There are 161 outputs available on this SoC.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 161.In logic system on chips, there are 6060 logic cells.This flash has a size of 128KB.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S005-1VFG256 System On Chip (SoC) applications.

  • Special Issue Information
  • Three phase UPS
  • Networked sensors
  • Wireless networking
  • Mobile computing
  • Industrial
  • High-end PLC
  • Optical drive
  • Smartphone accessories
  • sequence controllers

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