Parameters |
Factory Lead Time |
10 Weeks |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
256-LBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
MATTE TIN |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
161 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
161 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
161 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 5K Logic Modules |
Number of Logic Cells |
6060 |
Flash Size |
128KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 256-LBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.As one of the most important things to note is that this SoC security combines FPGA - 5K Logic Modules together.Housed in the state-of-art Tray package.As a whole, this SoC part is comprised of 161 inputs and outputs.It is recommended to use a 1.2V power supply.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.This SoC system on a chip can run on a power supply that is at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.There are 256 terminations in total and that really benefits system on a chip.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.There are 161 outputs available on this SoC.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 161.In logic system on chips, there are 6060 logic cells.This flash has a size of 128KB.This SoC processor also includes LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005-1VFG256 System On Chip (SoC) applications.
- Special Issue Information
- Three phase UPS
- Networked sensors
- Wireless networking
- Mobile computing
- Industrial
- High-end PLC
- Optical drive
- Smartphone accessories
- sequence controllers