LT5570IDD#PBF
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | PRODUCTION (Last Updated: 3 months ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 10-WFDFN Exposed Pad |
| Number of Pins | 10 |
| Packaging | Tube |
| Published | 2007 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 10 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Voltage - Supply | 4.75V~5.25V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Terminal Pitch | 0.5mm |
| Frequency | 40MHz~2.7GHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LT5570 |
| Pin Count | 10 |
| Temperature Grade | INDUSTRIAL |
| Operating Supply Current | 32.5mA |
| Accuracy | ±0.3dB |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| RF Type | Cellular, W-CDMA, TD-SCDMA, WiMax and CDMA2000 |
| Input Range | -52dBm ~ 13dBm |
| Height Seated (Max) | 0.8mm |
| Length | 3mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet