Parameters |
Factory Lead Time |
12 Weeks |
Package / Case |
448-FBGA Exposed Pad |
Supplier Device Package |
448-PBGA w/Heat Spreader (23x23) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Series |
QorlQ LS1 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
650MHz |
Core Processor |
ARM1136JF-S |
Ethernet |
GbE (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2 |
USB |
USB 2.0 + PHY (1) |
Additional Interfaces |
I2C, PCIe, PCM/TDM, SPI, UART |
RoHS Status |
ROHS3 Compliant |
LS101MASN7DFA Overview
The embedded microprocessor has been packed in 448-FBGA Exposed Pad for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~70°C TA. In the series QorlQ LS1, it is found. Core-wise, this CPU has a ARM1136JF-S processor. It has DDR2 RAM controllers. This microprocessor features interfaces I2C, PCIe, PCM/TDM, SPI, UART. Suppliers offer a package of 448-PBGA w/Heat Spreader (23x23).
LS101MASN7DFA Features
ARM1136JF-S Core
LS101MASN7DFA Applications
There are a lot of NXP USA Inc. LS101MASN7DFA Microprocessor applications.
- Removable disks
- Graphic terminals
- Fax machines
- Digital TVs
- Blood pressure monitors
- Hard drives
- Kindle
- X-ray
- Answering machines
- Speed meter