Parameters | |
---|---|
Factory Lead Time | 6 Weeks |
Lifecycle Status | ACTIVE (Last Updated: 3 days ago) |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-WFBGA, DSBGA |
Number of Pins | 6 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Voltage - Supply | 2.7V~5V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 4.5V |
Terminal Pitch | 0.4mm |
Frequency | 50MHz~8GHz |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | LMH2110 |
Pin Count | 6 |
Operating Supply Voltage | 5V |
Temperature Grade | INDUSTRIAL |
Number of Channels | 1 |
Element Configuration | Single |
Supply Current-Max | 5.5mA |
Accuracy | ±0.5dB |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | GSM, EDGE, CDMA |
Input Range | -40dBm ~ 5dBm |
Height | 675μm |
Length | 0m |
Width | 0m |
Thickness | 420μm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |