Parameters | |
---|---|
Factory Lead Time | 6 Weeks |
Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
Contact Plating | Copper, Silver, Tin |
Mounting Type | Surface Mount |
Package / Case | 6-WFBGA, DSBGA |
Surface Mount | YES |
Number of Pins | 6 |
Weight | 1.700971mg |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.39.00.01 |
Voltage - Supply | 2.7V~3.3V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 2.7V |
Terminal Pitch | 0.4mm |
Frequency | 50MHz~4GHz |
Base Part Number | LMH2100 |
Operating Temperature (Max) | 85°C |
Operating Temperature (Min) | -40°C |
Operating Supply Voltage | 3.3V |
Temperature Grade | INDUSTRIAL |
Operating Supply Current | 9.2mA |
Element Configuration | Single |
Nominal Supply Current | 7.1mA |
Accuracy | ±0.5dB |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | Cellular, W-CDMA, CDMA, GSM, UMTS |
Input Range | -45dBm ~ -5dBm |
Height | 675μm |
Length | 0m |
Width | 0m |
Thickness | 420μm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |