LM3290TMX/NOPB
| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 3 days ago) |
| Package / Case | 30-WFBGA, DSBGA |
| Surface Mount | YES |
| Number of Pins | 30 |
| Packaging | Tape & Reel (TR) |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 30 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Terminal Pitch | 0.4mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | LM3290 |
| Operating Temperature (Max) | 85°C |
| Temperature Grade | OTHER |
| Telecom IC Type | TELECOM CIRCUIT |
| Height | 675μm |
| Length | 0m |
| Width | 0m |
| Thickness | 420μm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet