| Parameters |
| Factory Lead Time |
8 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
Surface Mount |
| Package / Case |
1156-BBGA |
| Number of Pins |
1156 |
| Operating Temperature |
-40°C~100°C TJ |
| Packaging |
Tray |
| Published |
2012 |
| Series |
ECP3 |
| JESD-609 Code |
e1 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code |
8542.39.00.01 |
| Subcategory |
Field Programmable Gate Arrays |
| Voltage - Supply |
1.14V~1.26V |
| Terminal Position |
BOTTOM |
| Terminal Form |
BALL |
| Peak Reflow Temperature (Cel) |
250 |
| Supply Voltage |
1.2V |
| Terminal Pitch |
1mm |
| Reach Compliance Code |
not_compliant |
| Time@Peak Reflow Temperature-Max (s) |
30 |
| Base Part Number |
LFE3-150 |
| Number of Outputs |
586 |
| Qualification Status |
Not Qualified |
| Power Supplies |
1.2V |
| Number of I/O |
586 |
| RAM Size |
856.3kB |
| Clock Frequency |
375MHz |
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells |
149000 |
| Total RAM Bits |
7014400 |
| Number of LABs/CLBs |
18625 |
| Combinatorial Delay of a CLB-Max |
0.379 ns |
| Height Seated (Max) |
2.6mm |
| Length |
35mm |
| Width |
35mm |
| RoHS Status |
ROHS3 Compliant |
| Lead Free |
Lead Free |
LFE3-150EA-6FN1156I Overview
Fpga chips is supplied in the 1156-BBGA package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. A total of 586 I/Os allow data to be transferred in a more coherent manner. There are 149000 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.2V. The Field Programmable Gate Arrays family of FPGAs includes this part. With a Surface Mount connector, this FPGA module can be attached to the development board. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the ECP3 series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. This device is equipped with 586 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 7014400 bFpga chipss. In order to find related parts, use the part number LFE3-150 as a base. Fpga electronics is important that this FPGA module has a RAM si856.3kBe of 856.3kB in order to ensure that the program will run normally. The device has 1156 pins which are included in the design. Fpga electronics contains 18625 LABs/CLBs in an array. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. The device runs on a 1.2V battery and requires no additional power supply to operate. It usually uses a crystal oscillating at a frequency of 375MHz in order to do its work.
LFE3-150EA-6FN1156I Features
586 I/Os
Up to 7014400 RAM bits
1156 LABs/CLBs
LFE3-150EA-6FN1156I Applications
There are a lot of Lattice Semiconductor Corporation LFE3-150EA-6FN1156I FPGAs applications.
- Industrial IoT
- Software-defined radios
- Wired Communications
- ASIC prototyping
- Software-defined radio
- DO-254
- Data center search engines
- Consumer Electronics
- Cryptography
- Space Applications