LFE2M50SE-6FN900C
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2012 |
| Series | ECP2M |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE2M50 |
| Pin Count | 900 |
| Number of Outputs | 410 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Memory Size | 531kB |
| Number of I/O | 410 |
| RAM Size | 518.4kB |
| Clock Frequency | 357MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 48000 |
| Total RAM Bits | 4246528 |
| Number of LABs/CLBs | 6000 |
| Combinatorial Delay of a CLB-Max | 0.331 ns |
| Number of Logic Cells | 50000 |
| Height Seated (Max) | 2.6mm |
| Length | 31mm |
| Width | 31mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE2M50SE-6FN900C Overview
There is a 900-BBGA package that includes this component. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Having 410 I/Os makes data transfers more coherent. A fundamental building block contains 48000 logic elements or cells. 1.2V volts power it. Field Programmable Gate Arrays family FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the ECP2M series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. In this device, there are 410 outputs that can be used. There is an FPGA model contained in Tray in order to conserve space. There are a total of 900 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 4246528 bFpga chipss. In order to find related parts, you can use its base part number LFE2M50. The FPGA module's RAM si518.4kBe reaches 518.4kB in order to ensure that the program operates in a normal manner. 900 pins are designed into the device. 6000 LABs/CLBs are configured on this FPGA. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. There are a total of 900 pins on this device. Most commonly, this device makes use of an oscillating crystal frequency of 357MHz to operate. In this FPGA module, there is a memory of 531kB that can be used to store programs and data. For the building block of this system, 50000 logic cells are included.
LFE2M50SE-6FN900C Features
410 I/Os
Up to 4246528 RAM bits
900 LABs/CLBs
LFE2M50SE-6FN900C Applications
There are a lot of Lattice Semiconductor Corporation LFE2M50SE-6FN900C FPGAs applications.
- Integrating multiple SPLDs
- Broadcast
- Bioinformatics
- Distributed Monetary Systems
- Data Center
- Server Applications
- Computer hardware emulation
- High Performance Computing
- Secure Communication
- Cryptography