LE89010QVCT
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Lifecycle Status | OBSOLETE (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 48-LQFP |
| Packaging | Tape & Reel (TR) |
| Published | 2010 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
LE89010QVCT Overview
Telecommunications equipment is packed using the Tape & Reel (TR) method.Telecommunications equipment is mounted using Surface Mount.A 1 circuit is the heart of this telecom IC .
LE89010QVCT Features
LE89010QVCT Applications
There are a lot of Microchip Technology LE89010QVCT Telecom applications.
- T1 Digital Cross Connects (DSX-1)
- High speed data transmission line cards
- Fault Tolerant Systems
- Home Side Box
- PDH Multiplexers
- Interfaces to DS3
- Interfaces to SONET STS-1 Networks
- DECT (Digital European Cordless Telephone) Base
- Wireless base stations
- ATM equipment with integrated DS1 interfaces