LE88231DLC
| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 80-LQFP |
| Packaging | Tray |
| Published | 2005 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Function | Telecom Circuit |
| Interface | PCM |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
LE88231DLC Overview
Saving board space is achieved with the 80-LQFP package.Telecommunications equipment is packed according to Tray's method.A Surface Mount-mount is used for mounting the telecom circuit.An 2-circuit makes up this telecom IC .A Surface Mount-axis mounts telecom switching.
LE88231DLC Features
Available in the 80-LQFP package
LE88231DLC Applications
There are a lot of Microchip Technology LE88231DLC Telecom applications.
- E1 Multiplexer
- Cross Connects
- Multi-Line E1 Interface Cards
- Voice over IP/DSL
- T1/E1/J1 LAN/WAN Routers
- Interfaces to DS3
- High-Density T1/E1/J1 interfaces for Multiplexers
- Channel Banks
- E1 Network Equipment
- Dual battery supply voltage SLICs