ISL61862BCRZ
| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Mount | Surface Mount |
| Package / Case | DFN |
| Number of Pins | 8 |
| Published | 2004 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 2 |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Subcategory | Power Management Circuits |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 5.5V |
| Power Supplies | 5V |
| Temperature Grade | COMMERCIAL |
| Supply Voltage-Min (Vsup) | 2.5V |
| Number of Channels | 1 |
| Analog IC - Other Type | POWER SUPPLY SUPPORT CIRCUIT |
| Adjustable Threshold | NO |
| Height Seated (Max) | 1mm |
| Length | 3mm |
| Width | 3mm |
| RoHS Status | RoHS Compliant |
ISL61862BCRZ Overview
The DFN package includes it.At the moment, there are 1 channels available.Total terminations are 8.There is a DUAL terminal position on the device.High efficiency can be achieved when the supply voltage is 5V.8 pins are used in operation.Power Management Circuits contains this gadget all by itself.The position of the object is in the direction of Surface Mount.Stable operation is enabled by a maximum operating temperature of 70°C°C.Hot-swappable device operates at a minimum temperature of 0°C degrees Celsius in order to ensure reliabilHot-swappable devicey.For normal operation, Vsup should be maintained above 2.5V.Vsup (maximum supply voltage) is set to 5.5V.The power supplies of the part is 5V.This gadget uses an analog IC, which is POWER SUPPLY SUPPORT CIRCUIT in this case.
ISL61862BCRZ Features
ISL61862BCRZ Applications
There are a lot of Intersil (Renesas Electronics America) ISL61862BCRZ hot swap controllers applications.
- Other forms of communications infrastructure
- Servers
- Modern analog communication
- PC board hot swap insertion and removal
- Continuous monitoring of device temperature
- Electric vehicle
- High power circuit board
- Circuit breakers for high-side circuits
- Avionics systems
- Limitting the inrush current