HSEC8-140-01-L-D-EM2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Weeks |
| Contact Material | Beryllium Copper |
| Mounting Type | Board Edge, Straddle Mount |
| Housing Material | Polymer |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Mounting Option 1 | LOCKING |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Published | 2015 |
| Series | Edge Rate™ HSEC8 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 80 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| HTS Code | 8536.69.40.40 |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 80 |
| Orientation | Straight |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 1.984 inch |
| UL Flammability Code | 94V-0 |
| Body Depth | 0.504 inch |
| Contact Style | BELLOWED TYPE |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Body/Shell Style | SOCKET |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Plating Thickness | 10μin |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
HSEC8-140-01-L-D-EM2 Overview
Packaging was conducted in accordance with Tube's specifications.There is a recommendation for mounting type Board Edge, Straddle Mount.The device is connected using the connector socket CARD EDGE CONNECTOR.Edge Rate? HSEC8 tells you the series of the device.
HSEC8-140-01-L-D-EM2 Features
Edge Rate? HSEC8 series
HSEC8-140-01-L-D-EM2 Applications
There are a lot of Samtec Inc. HSEC8-140-01-L-D-EM2 Edgeboard Connectors applications.
- High Speed Data Acquisition for PCs
- AC motor control
- Industrial Process Control
- 3-phase power control
- Telecommunications
- Data Acquisition Systems
- CMOS Image sensors for mobile applications
- Communication test equipment
- Music recording
- In-building wireless telephony