HSEC8-110-01-L-RA-TR
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount, Right Angle |
| Housing Material | Polymer |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| Series | Edge Rate™ HSEC8 |
| JESD-609 Code | e3 |
| Feature | Board Guide |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 20 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Cantilever |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 20 |
| Orientation | Right Angle |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 0.853 inch |
| Body Depth | 0.474 inch |
| Contact Resistance | 15mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 10 |
| Body/Shell Style | SOCKET |
| Mating Contact Row Spacing | 0.069 inch |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
HSEC8-110-01-L-RA-TR Overview
Packing was done according to Tape & Reel (TR)'s specs.It is recommended that you mount the device with mounting type Surface Mount, Right Angle.This device is connected through the connector socket CARD EDGE CONNECTOR.In addition to the device's features, it has Board Guide.A Edge Rate? HSEC8 means the device is a series device.
HSEC8-110-01-L-RA-TR Features
Edge Rate? HSEC8 series
HSEC8-110-01-L-RA-TR Applications
There are a lot of Samtec Inc. HSEC8-110-01-L-RA-TR Edgeboard Connectors applications.
- 4-channel data acquisition
- Smart antenna systems
- Communication test equipment
- CMOS Image sensors for mobile applications
- Multiplexed Data Acquisition Systems
- In-building wireless telephony
- 3-phase power control
- Micro and pico cell systems, software radios
- Digital Multimeters, PLC's (Programming Logic Controllers)
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,