HPCS6002C.A0-998950

HPCS6002C.A0-998950

Telecom device


  • Manufacturer: Inphi Corporation
  • Origchip NO: 180-HPCS6002C.A0-998950
  • Package: 1517-BBGA
  • Datasheet: -
  • Stock: 838
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 1517-BBGA
Packaging Tray
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1V 1.8V 2.5V
Reach Compliance Code compliant
Function Optical Transport Processor
Interface SFI-4.1, SFI-4.2, SFI-5.1, XAUI, XFI

HPCS6002C.A0-998950 Overview


A 1517-BBGA package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.Wtelecom IC's efficiencyh a high supply voltage, 1V 1.8V 2.5V can be operated more efficiently.

HPCS6002C.A0-998950 Features


Available in the 1517-BBGA package

HPCS6002C.A0-998950 Applications


There are a lot of Inphi Corporation HPCS6002C.A0-998950 Telecom applications.

  • Switching Systems
  • Cable Modem
  • Hybrid fiber coax (HFC)
  • LAN Routers
  • E1 Network Equipment
  • E1 LAN/WAN Routers
  • Digital cross connects (DSX-1)
  • Digital Cross-connect Systems (DCS)
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • NIU

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